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Exploring high-performance processor architecture beyond the exascale None
Xiang-hui XIE, Xun JIA
Frontiers of Information Technology & Electronic Engineering 2018, Volume 19, Issue 10, Pages 1224-1229 doi: 10.1631/FITEE.1800424
Keywords: High-performance computing Beyond the exascale Processor architecture Application-customized hardware
Development and Application of Simulation Technology
Wang Zicai
Strategic Study of CAE 2003, Volume 5, Issue 2, Pages 40-44
Keywords: simulation technology system simulation hardware in loop simulation distributed interactive simulation
A Hardware Platform Framework for an Intelligent Vehicle Based on a Driving Brain Article
Deyi Li,Hongbo Gao
Engineering 2018, Volume 4, Issue 4, Pages 464-470 doi: 10.1016/j.eng.2018.07.015
Keywords: Driving brain Intelligent driving Hardware platform framework
Managing obsolescence of embedded hardware and software in secure and trusted systems
Zachary A. COLLIER, James H. LAMBERT
Frontiers of Engineering Management 2020, Volume 7, Issue 2, Pages 172-181 doi: 10.1007/s42524-019-0032-5
Keywords: enterprise risk management diminishing manufacturing sources and material shortages scenario-based preferences systems engineering deep uncertainty product life cycle
Real-time pre-processing system with hardware accelerator for mobile core networks Article
Mian CHENG, Jin-shu SU, Jing XU
Frontiers of Information Technology & Electronic Engineering 2017, Volume 18, Issue 11, Pages 1720-1731 doi: 10.1631/FITEE.1700507
Keywords: Mobile network Real-time processing Hardware acceleration
A Research Review on the Key Technologies of Intelligent Design for Customized Products
Shuyou Zhang, Jinghua Xu, Huawei Gou, Jianrong Tan
Engineering 2017, Volume 3, Issue 5, Pages 631-640 doi: 10.1016/J.ENG.2017.04.005
Keywords: Customized products Customer requirements Variant design Intelligent design Knowledge push
Development Strategy for the Core Software and Hardware of Artificial Intelligence in China
Gao Lei, Fu Yongquan, Li Dongsheng, Liao Xiangke
Strategic Study of CAE 2021, Volume 23, Issue 3, Pages 90-97 doi: 10.15302/J-SSCAE-2021.03.008
Keywords: artificial intelligence (AI) core software and hardware AI chip basic intelligent algorithm new enabling
Future Internet: trends and challenges Special Feature on Future Network-Review Article
Jiao ZHANG, Tao HUANG, Shuo WANG, Yun-jie LIU
Frontiers of Information Technology & Electronic Engineering 2019, Volume 20, Issue 9, Pages 1185-1194 doi: 10.1631/FITEE.1800445
Keywords: Future Internet Network architecture Service customized network
Status quo and outlook of reconfigurable research
Li Yufeng,Qiu Han,Lan Julong
Strategic Study of CAE 2008, Volume 10, Issue 7, Pages 82-89
Keywords: internet reconfigurable router reconfigurable network programmable hardware
Dual-Material Electron Beam Selective Melting: Hardware Development and Validation Studies Article
Chao Guo, Wenjun Ge, Feng Lin
Engineering 2015, Volume 1, Issue 1, Pages 124-130 doi: 10.15302/J-ENG-2015013
Electron beam selective melting (EBSM) is an additive manufacturing technique that directly fabricates three-dimensional parts in a layerwise fashion by using an electron beam to scan and melt metal powder. In recent years, EBSM has been successfully used in the additive manufacturing of a variety of materials. Previous research focused on the EBSM process of a single material. In this study, a novel EBSM process capable of building a gradient structure with dual metal materials was developed, and a powder-supplying method based on vibration was put forward. Two different powders can be supplied individually and then mixed. Two materials were used in this study: Ti6Al4V powder and Ti47Al2Cr2Nb powder. Ti6Al4V has excellent strength and plasticity at room temperature, while Ti47Al2Cr2Nb has excellent performance at high temperature, but is very brittle. A Ti6Al4V/Ti47Al2Cr2Nb gradient material was successfully fabricated by the developed system. The microstructures and chemical compositions were characterized by optical microscopy, scanning microscopy, and electron microprobe analysis. Results showed that the interface thickness was about 300 μm. The interface was free of cracks, and the chemical compositions exhibited a staircase-like change within the interface.
Keywords: additive manufacturing electron beam selective melting gradient materials titanium alloy TiAl alloy
A Motion-Adaptive Algorithm for Video Scan Format Conversion and the Hardware Implementation
Zhang Guanglie,Zheng Nanning,Wu Yong,Zhang Xia
Strategic Study of CAE 2001, Volume 3, Issue 6, Pages 41-47
Keywords: scan format conversion motion adaptive deinterlacing edge-preserved noise-reduced filter
Development Strategy of Industrial Software for Iron and Steel Industry
Cong Liqun, Zhang Yungui, Liu Qiang, Wang Yi, Li Hui
Strategic Study of CAE 2022, Volume 24, Issue 4, Pages 167-176 doi: 10.15302/J-SSCAE-2022.04.011
Superimposing a customized development mode and insufficient R&
Software development in a customized way is a competitive strategyHowever, the drawbacks of customized development cannot be ignored, especially customized software developmentThe traditional business models of software product license and customized development still exist, but
Keywords: industry intelligent manufacturing industrial software enterprise informatization automatic control customized
Development Trends in Additive Manufacturing and 3D Printing Perspective
Bingheng Lu, Dichen Li, Xiaoyong Tian
Engineering 2015, Volume 1, Issue 1, Pages 85-89 doi: 10.15302/J-ENG-2015012
Keywords: additive manufacturing 3D printing fabrication modes customized fabrication innovative design
Co-design and Co-simulation on the System Level
Xu Hui,Wang Zuqiang,Wang Zhaojun
Strategic Study of CAE 2006, Volume 8, Issue 4, Pages 86-88
The article introduces the technology of co-design and co-simulation on the system level and the system simulation tool-Cocentric system studio. At last,it will provide an example of SW/HW co-simulation in the environment.
Keywords: system on a chip software/hardware co-simulate system C CCSS (CoCentric system studio)
Recent advances in efficient computation of deep convolutional neural networks Review
Jian CHENG, Pei-song WANG, Gang LI, Qing-hao HU, Han-qing LU
Frontiers of Information Technology & Electronic Engineering 2018, Volume 19, Issue 1, Pages 64-77 doi: 10.1631/FITEE.1700789
Keywords: Deep neural networks Acceleration Compression Hardware accelerator
Title Author Date Type Operation
Exploring high-performance processor architecture beyond the exascale
Xiang-hui XIE, Xun JIA
Journal Article
A Hardware Platform Framework for an Intelligent Vehicle Based on a Driving Brain
Deyi Li,Hongbo Gao
Journal Article
Managing obsolescence of embedded hardware and software in secure and trusted systems
Zachary A. COLLIER, James H. LAMBERT
Journal Article
Real-time pre-processing system with hardware accelerator for mobile core networks
Mian CHENG, Jin-shu SU, Jing XU
Journal Article
A Research Review on the Key Technologies of Intelligent Design for Customized Products
Shuyou Zhang, Jinghua Xu, Huawei Gou, Jianrong Tan
Journal Article
Development Strategy for the Core Software and Hardware of Artificial Intelligence in China
Gao Lei, Fu Yongquan, Li Dongsheng, Liao Xiangke
Journal Article
Future Internet: trends and challenges
Jiao ZHANG, Tao HUANG, Shuo WANG, Yun-jie LIU
Journal Article
Dual-Material Electron Beam Selective Melting: Hardware Development and Validation Studies
Chao Guo, Wenjun Ge, Feng Lin
Journal Article
A Motion-Adaptive Algorithm for Video Scan Format Conversion and the Hardware Implementation
Zhang Guanglie,Zheng Nanning,Wu Yong,Zhang Xia
Journal Article
Development Strategy of Industrial Software for Iron and Steel Industry
Cong Liqun, Zhang Yungui, Liu Qiang, Wang Yi, Li Hui
Journal Article
Development Trends in Additive Manufacturing and 3D Printing
Bingheng Lu, Dichen Li, Xiaoyong Tian
Journal Article